Production Facilities |
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Wafer Sort
1. Eg2001X / EG2001CX / EG2001 CXE Electroglas Wafer Probers
2.
Accretech TSK UF200 / UF200A 8 inch Wafer Probers
3.
Espec Chamber (98% / 95 celsius) / Hast Chamber (85% / 135 celsius)
4.
Die sorting Tape & Real Machine
5.
AVI ICOS W-2200
6.
DISCO sawing machine (DFD 641 / DAD6340)
7.
Back grind Disco DFG 8540
& Break Machine |
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RF Testing
1. Handler |
- SRM Handler
- EXIS - Tech Handler
- ISMECA Handler
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| 2. Rack & Stack System |
- Support up to 26.5GHz testing frequency
- MXA+MXG to support high speed GAIN, ACPR/ACLR, Harmonics, NF measurement with LXI platform
- ENA to support S-parameter measurement
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Assembly
1. Die Attach ASM 829/830/838
2.
ASM MCM-12
3.
Wire Bond Kaijo/ASM iHawk/KNS
4.
MARCH Strip & Oven Plasma
5.
ASM Automold
6.
Laser Mark
7.
Disco Saw Machine
8.
Video contact angle
9.
Keyence CCD Laser Displacement Sensor |
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Failure Analysis
1. 2D X-Ray
2.
Cross-section
3.
Acid De-cap
4.
CSAM
5.
XRF
6.
High Magnification Microscope
7.
Chambers & Ovens |
- Humidity Chamber oven 85degC@85% RH
- Humidity Chamber oven 95degC@98% RH
- Autoclave 121degC@100%RH, 2 ATM
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SMT
1. Yamaha Pcik & Place (YV100X, YV180Xg, YS12, YS24)
2. Reflow over Heller 1700 / 1809 EXL
3. MPM Ultra Print 2000 Solder paste printer / Ekra XPRT 3 Printer
4. In-line Aqua wash machine
5. MCM12 Flip Chip Bonder
6. Samsung CP45SV Pick & Place |
