Category |
Description |
Unit |
Inari |
Wafer sort |
Wafer backlap - Si wafer |
|
Yes |
| -Max wafer size |
in |
8 |
| -Min thickness |
um |
125 |
| - Thickness accuracy |
um |
12.5 |
| Wafer DC probe |
|
Yes |
| Wafer RF probe |
|
Yes |
Auto wafer visual and reject capture into
wafer map (inkless wafer map) |
|
Yes |
| Manual wafer visual and inking |
|
Yes |
| Wafer saw - Si wafer |
|
Yes |
| Wafer saw - GaAs wafer |
|
No |
| Wafer scribe and break |
|
Yes |
| Wafer laser cut |
|
No |
| Die level tape and reel (for die sell) |
|
Yes |
SMT |
Smallest SMT component |
|
01005 |
| Die level SMT (gold pad) |
|
Yes |
| Smallest 01005 pad |
um |
175x225 |
DA |
Thinnest die (Si and GaAs) |
mil |
4 |
| Smallest die size |
mil |
7.3x7.3 |
| Medium thermal epoxy (3-10W/mK) |
|
1295SA |
| Low thermal epoxy (<3W/mK) |
|
84-1LMIS |
| Eutectic DA capability |
|
No |
Biggest die aspect ratio for GaAs die with 4-
5mil thickness |
|
2:1 |
| Post DA, auto chip coating |
|
No |
| Stack die capability |
|
Yes |
| Flip chip capability |
|
Yes |
WB |
Gold wire size |
mil |
1.0 |
| Al pad bonding capability |
|
Yes |
| Die to die bonding capability |
|
Yes |
Gold ball bond, min bond pad opening for
1mil wire |
um |
60 x 60 |
| Gold ball bond, min wire loop for 1.0mil wire |
um |
100(Std. Bond)
60(RSSB) |
| Minimum bond pad pitch for 1.0mil wire |
um |
75(Bond pad on
die)
75(Bond pad on
PCB) |
Gold ball bond, min bond pad opening for
0.8mil wire |
um |
NA |
| Gold ball bond, min wire loop for 0.8mil wire |
um |
NA |
| Minimum bond pad pitch for 0.8mil wire |
um |
NA |
Mold |
Available mold cap height |
mm |
0.5 and 0.6 |
Ultra low stress compound - for product with
high internal stress |
|
Yes |
Mold mc with void vacuum (qty) / total mold
mc qty |
|
Yes |
Mold mc with panel vacuum(qty) / total
mold mc qty |
|
Yes |
Saw |
Package saw accuracy |
um |
50 |
| Smallest package |
mm |
1.6 x 2.0 |
Test |
RF Test capability |
|
Yes |
Reliability |
IR |
|
Yes |
| UBPP |
|
Yes |
FA |
X-Section / Backlap |
|
Yes |
| X-Ray |
|
Yes |
| T/C - Scan |
|
Yes |
